MC13892_1107 Datasheet, PDF (11/158 Pages) Freescale Semiconductor, Inc – Power Management Integrated

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Charger and USB Input Voltage⁽⁵⁾
MODE pin Voltage
Main/Aux/Keypad Current Sink Voltage
Battery Voltage
Coin Cell Voltage
ESD Voltage⁽⁶⁾
Human Body Model - HBM with Mode pin excluded⁽⁹⁾
Charge Device Model - CDM
V_CHRGR
-0.3 to 20
V
V_MODE
-0.3 to 9.0
V
V_LEDMD,
-0.3 to 28
V
V_LEDAD,
V_LEDKP
V_BATT
-0.3 to 4.8
V
V_LICELL
-0.3 to 3.6
V
V_ESD
V
±1500
±250
THERMAL RATINGS
Ambient Operating Temperature Range
T_A
-40 to +85
°C
Operating Junction Temperature Range
T_J
-40 to +125
°C
Storage Temperature Range
T_STG
-65 to +150
°C
THERMAL RESISTANCE
Peak Package Reflow Temperature During Reflow⁽⁷⁾, ⁽⁸⁾
T_PPRT
Note 8
°C
Notes
5. USB Input Voltage applies to UVBUS pin only
6. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model (CDM), Robotic (CZAP = 4.0 pF).
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
9. Mode Pin is not ESD protected.
Table 4. Dissipation Ratings
Rating Parameter
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
Condition
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Symbol
R_θJA
R_θJMA
R_θJMA
R_θJMA
R_θJB
R_θJC
θJT
VK Package
104
54
88
49
32
29
7.0
VL Package
65
42
55
38
28
22
5.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC13892
11