MC34119DTBR2 Datasheet, PDF (10/12 Pages) Freescale Semiconductor, Inc – LOW POWER AUDIO AMPLIFIER

NOTE 2
8
5
1
4
F
–A–
–B–
MC34119
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
L
–T–
SEATING
PLANE
H
C
J
N
D
K
M
G
0.13 (0.005) M T A M B M
–A–
8
5
–B–
1
4
G
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
J
M_
–T–
8X D
SEATING
PLANE
0.25 (0.010) M T B S A S
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G
2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M ––– 10_ ––– 10_
N 0.76 1.01 0.030 0.040
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 4.80 5.00
B 3.80 4.00
C 1.35 1.75
D 0.35 0.49
F 0.40 1.25
G
1.27 BSC
J 0.18 0.25
K 0.10 0.25
M 0_{_} 7_{_}
P 5.80 6.20
R 0.25 0.50
10
MOTOROLA ANALOG IC DEVICE DATA