MCIMX31_07 Datasheet, PDF(1/108 Page) Freescale Semiconductor, Inc

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MCIMX31_07 Datasheet, PDF (1/108 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processors

Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MCIMX31

Rev. 2.3, 03/2007

MCIMX31 and

MCIMX31L

i.MX31 and i.MX31L

Multimedia Applications

Processors

Package Information

Plastic Package

Case 1581 14 x 14 mm, 0.5 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1 Introduction

The i.MX31 (MCIMX31) and i.MX31L (MCIMX31L)

are multimedia applications processors that represent the

next step in low-power, high-performance application

processors. Unless otherwise specified, the material in

this data sheet is applicable to both the i.MX31 and

i.MX31L processors. The i.MX31L does not include a

graphics processing unit (GPU).

Based on an ARM11â¢ microprocessor core, the

i.MX31 and i.MX31L provide the performance with

low power consumption required by modern digital

devices such as:

â¢ Feature-rich cellular phones

â¢ Portable media players and mobile gaming

machines

â¢ Personal digital assistants (PDAs) and Wireless PDAs

â¢ Portable DVD players

â¢ Digital cameras

The i.MX31 and i.MX31L take advantage of the

ARM1136JF-Sâ¢ core running at overdrive speeds of

532 MHz, and are optimized for minimal power

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

1.2 Ordering Information . . . . . . . . . . . . . . . . . . . .3

1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . .4

2 Functional Description and Application

Information

2.1 ARM11 Microprocessor Core . . . . . . . . . . . . . .4

2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . . . .6

3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . .9

4 Electrical Characteristics . . . . . . . . . . . . . . . . .10

4.1 i.MX31 and i.MX31L Chip-Level Conditions . .10

4.2 Supply Power-Up/Power-Down Requirements

and Restrictions

4.3 Module-Level Electrical Specifications . . . . . .16

5 Package Information and Pinout . . . . . . . . . . .98

5.1 MAPBGA Production Package . . . . . . . . . . . .98

6 Product Documentation . . . . . . . . . . . . . . . . . .105

6.1 Revision History . . . . . . . . . . . . . . . . . . . . . .106

This document contains information on a new product. Specifications and information herein are subject to change without notice.

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