IMX51 Datasheet, PDF (1/184 Pages) Freescale Semiconductor, Inc – i.MX51 Applications Processors for Consumer and Industrial Products

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX51CEC
Rev. 1, 11/2009
IMX51
i.MX51 Applications
Processors for Consumer and
Industrial Products
Package Information
Plastic Package
Case 2058 13 x 13 mm, 0.5 mm pitch
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
The i.MX51 multimedia applications processors
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
represent Freescale Semiconductor’s latest addition to a
2.1 Special Signal Considerations. . . . . . . . . . . . . . . . 12
growing family of multimedia-focused products offering
3
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 14
high performance processing optimized for lowest
3.2 Supply Power-Up/Power-Down Requirements and
power consumption.
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 21
The i.MX51 processors feature Freescale’s advanced
and power-efficient implementation of the ARM Cortex
3.4 Output Buffer Impedance Characteristics . . . . . . . 28
3.5 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31
3.6 Module Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
A8™ core, which operates at speeds as high as
3.7 External Peripheral Interfaces . . . . . . . . . . . . . . . . 60
800 MHz. Up to 200 MHz DDR2 and mobile DDR
DRAM clock rates are supported. These devices are
suitable for applications such as the following:
4 Package Information and Contact Assignments . . . . . . 137
4.1 13 × 13 mm Package Information . . . . . . . . . . . . 137
4.2 19 × 19 mm Package Information . . . . . . . . . . . . 156
4.3 13 × 13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 174
• Netbooks (web tablets)
4.4 19 x 19 mm, 0.8 Pitch Ball Map. . . . . . . . . . . . . . 179
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
• Nettops (internet desktop devices)
• Mobile internet devices (MID)
• Portable media players (PMP)
• Portable navigation devices (PND)
• High-end PDAs
• Gaming consoles
• Automotive navigation and entertainment (see
automotive data sheet, IMX51AEC)
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Preliminary—Subject to Change Without Notice