IMX35_1 Datasheet, PDF (1/148 Pages) Freescale Semiconductor, Inc – i.MX35 Applications Processors for Industrial and Consumer Products

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCIMX35SR2CEC
Rev. 6, 10/2009
IMX35
i.MX35 Applications
Processors for Industrial
and Consumer Products
Silicon Revisions 2.0 and 2.1
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The i.MX353 and the i.MX357 multimedia
applications processors represent the next
generation of ARM11 products with the right
performance and integration to address applications
within the industrial and consumer markets for
applications such as HMI and display controllers.
Unless otherwise specified, the material in this data
sheet is applicable to both the i.MX353 and
i.MX357 devices and referred to singularly
throughout this document as i.MX35 or
MCIMX35. The i.MX353 devices do not include a
graphics processing unit (GPU). For information on
i.MX35 devices for automotive applications, please
refer to document number, MCIMX35SR2AEC.
The i.MX35 processor takes advantage of the
ARM1136JF-S™ core running at 532 MHz that is
boosted by a multi-level cache system and
integrated features such as LCD controller,
Ethernet, and graphics acceleration for creating rich
user interfaces.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Functional Description and Application Information . . . . . 4
2.1 Application Processor Domain Overview. . . . . . . . . 4
2.2 Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 5
2.3 Advanced Power Management Overview . . . . . . . . 5
2.4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 5
2.5 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Signal Descriptions: Special Function Related Pins . . . . 11
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.3 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.5 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 17
4.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 18
4.7 I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20
4.8 I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23
4.9 Module-Level AC Electrical Specifications. . . . . . . 29
5 Package Information and Pinout . . . . . . . . . . . . . . . . . . 130
5.1 MAPBGA Production Package 1568-01, 17 × 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
5.2 MAPBGA Signal Assignments. . . . . . . . . . . . . . . 132
6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 145
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.