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MUR860E Datasheet, PDF (6/6 Pages) Foshan Blue Rocket Electronics Co.,Ltd. – TO-277 Plastic package Schottky diode | |||
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MUR860E
Rev.F May.-2016
DATA SHEET
åæµç温度æ²çº¿å¾(æ é
) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说æï¼
1ãé¢ç温度 25ï½150âï¼æ¶é´ 60ï½90sec;
2ãå³°å¼æ¸©åº¦ 245±5âï¼æ¶é´æç»ä¸º 5±0.5sec;
3ãçæ¥å¶ç¨å·å´é度为 2ï½10â/sec.
Note:
1.Preheating:25~150â, Time:60~90sec.
2.Peak Temp.:245±5â, Duration:5±0.5sec.
3. Cooling Speed: 2~10â/sec.
èçæ¥çè¯éªæ¡ä»¶ / Resistance to Soldering Heat Test Conditions
温度ï¼260±5â
æ¶é´ï¼10±1 sec.
Temp.:260±5â
Time:10±1 sec
å
è£
è§æ ¼ / Packaging SPEC.
å·çå
è£
/ REEL
Package Type
å°è£
å½¢å¼
TO-277
Units/Reel
åª/å·ç
5,000
Reels/Inner Box
å·ç/ç
3
Units å
è£
æ°é
Units/Inner Box Inner Boxes/Outer Box
åª/ç
ç/ç®±
15,000
5
Units/Outer Box
åª/ç®±
75,000
Dimension å
è£
尺寸 (unitï¼mm3)
Reel
Inner Box ç
Outer Box ç®±
13ãÃ12 360Ã360Ã50 385Ã257Ã392
使ç¨è¯´æ / Notices
http://www.fsbrec.com
6/6
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