MDS12L Datasheet, PDF (6/7 Pages) Formosa MS – SMD Low VF Schottky Bridge Rectifier

SMD Low VF Schottky Bridge Rectifier
MDS12L THRU MDS110L
Formosa MS
Reel packing
PACKAGE
REEL SIZE
TO-269AA (MDS)
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
2,500
8.0
BOX
(pcs)
INNER
BOX
(m/m)
5,000 337*337*37
REEL
DIA,
(m/m)
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
40,000
APPROX.
GROSS WEIGHT
(kg)
11.8
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5^oC~40^oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25^oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5^oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25^oC to Peak Temperature
Soldering Condition
<3^oC/sec
150^oC
200^oC
60~120sec
<3^oC/sec
217^oC
60~260sec
255^oC-0/+5^oC
10~30sec
<6^oC/sec
<6minutes
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
Page 6
Document ID Issued Date
DS-241660 2009/08/10
Revised Date Revision
2014/06/04
D
Page.
7