HVS6003-002 Datasheet, PDF (6/8 Pages) Finisar Corporation. – PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE

HVS6003-002
PHOTOREFLECTIVE SENSOR
DIP SOLDER PROFILE:
1. Preheat temperature for soldering : 120 - 150 ºC, for 60 - 120 seconds
2. At 200ºC, soldering time is 30s - 60s
3. At 260ºC, MAX soldering time is less than 5 sec
4. Number of dip soldering process must be less than 2 times and the process is to be performed in sequence. Cooling
process to normal temperature will be required between the first and the second soldering process.
RECOMMENDED PAD LAYOUT:
Dimensions in mm, tolerance ±0.1mm
4.0mm ^5.1mm
1.2mm
2.3mm