LMA246 Datasheet, PDF (4/4 Pages) Filtronic Compound Semiconductors – LOW NOISE PHEMT MMIC

• MECHANICAL OUTLINE
LMA246
LOW NOISE PHEMT MMIC
Notes:
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All units are in microns (µm).
All bond pads are 100 X 100 µm².
Bias pad (V_DD) size is 100 X 121.5 µm².
Unless otherwise specified.
• HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control
measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
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Revised: 12/05/00
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