LMA246 Datasheet, PDF (3/4 Pages) Filtronic Compound Semiconductors – LOW NOISE PHEMT MMIC

• ASSEMBLY DRAWING
LMA246
LOW NOISE PHEMT MMIC
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Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C.
Maximum time at temperature is 1 minute. Use of forming gas (90% N₂ , 10% H₂ ) for best results.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
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Revised: 12/05/00
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