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LMA411 Datasheet, PDF (3/5 Pages) Filtronic Compound Semiconductors – LOW NOISE PHEMT MMIC | |||
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⢠ASSEMBLY DRAWING
LMA411
LOW NOISE PHEMT MMIC
50% of Idss BIAS
Notes:
⢠Recommended lead bond technique is thermocompression wedge bonding with 0.001â (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
⢠The recommended die attach is a eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C.
Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results.
⢠Bond on bond or stitch bond acceptable.
⢠Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 09/07/01
Email: sales@filss.com
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