LPV3000 Datasheet, PDF (2/2 Pages) Filtronic Compound Semiconductors – 2W Power PHEMT

Filtronic
Solid State
LP3000/LPV3000
2W Power PHEMT
ABSOLUTE MAXIMUM RATINGS
SYMBOL
(25°C)
PARAMETER
RATING¹
V_DS
V_GS
I_DS
I_G
P_IN
T_CH
T_STG
P_T
Drain-Source Voltage
Gate-Source Voltage
Drain-Source Current
Gate Current
RF Input Power
Channel Temperature
Storage Temperature
Power Dissipation
12V
-5V
2 x I_DSS
120 mA
1.2 W
175°C
-65/175°C
6.0W^3,4
RECOMMENDED CONTINUOUS
OPERATING LIMITS
SYMBOL
PARAMETER
RATING²
V_DS
V_GS
I_DS
I_G
P_IN
T_CH
T_STG
P_T
G_XdB
Drain-Source Voltage
Gate-Source Voltage
Drain-Source Current
Gate Current
RF Input Power
Channel Temperature
Storage Temperature
Power Dissipation
Gain Compression
8V
-1V
0.8 x I_DSS
40 mA
600 mW
150°C
-20/50°C
5.0 W^3,4
8 dB
NOTES:
1. Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
2. Recommended Continuous Operating Limits should be observed for reliable device operation.
3. Power Dissipation defined as: P_T ≡ (P_DC + P_IN) - P_OUT, where: P_DC = DC bias power, P_OUT = RF output power, and
P_IN = RF input power.
4. Power Dissipation to be de-rated as follows:
P_T(W)
5. Specifications subject to change without notice.
Example #1 :
6.0
-40 mW/°C
V_DS = 8V, I_DS = 535 mA
P_IN = P_OUT = 0 dBm (quiescent condition):
5.0
P_T = P_DC = 4.28W
Max. continuous T_HS = 25°C
-40 mW/°C
Example #2:
V_DS = 8V, I_DS = 535 mA
P_IN = 26.5 dBm P_OUT = 33.5 dBm
P_T = (4.28+0.45) - 2.24 = 2.49W
Max. continuous T_HS = 88°C
HANDLING PRECAUTIONS:
25
150 175 _THS(°C)
PHEMT chips should be stored in a dry nitrogen environment until assembly. Care should be exercised during handling to
avoid damage to the devices. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of
storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500V), and further information
on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
ASSEMBLY INSTRUCTIONS:
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-
290°C; maximum time at temperature is 1 min. The recommended wire bond method is thermo-compression wedge
bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260°C.
APPLICATIONS NOTES AND DESIGN DATA:
Applications Notes are available from your local FSS Sales Representative, or directly from the factory. Complete design
data, including S-parameters, Noise data, and Large-Signal models, is available on 3.5” diskette, or may be down-loaded
from our Web Page.
Get Curtice Model
DSS-027 WG
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