FMS2020 Datasheet, PDF (2/4 Pages) Filtronic Compound Semiconductors – GaAs Multi-Purpose Wide Band SPDT Switch

Advanced Product Information ^1.1
Truth Table:
V1
V2
High
Low
Low
Note:
‘High’
‘Low’
High
= +2.5V to +5V
= 0V to 0.2V
PATH (ON)
RF1-ANT
RF2-ANT
Pad and Die Layout:
FMS2020
B
D
F
G
C
Pad
Pad
Description Pin Coordinates
Name
(µm)
A
ANT
Antenna
732, 510
B
RF1
RF1 Output
A
C
RF2
RF2 Output
270, 920
280, 101
D
V1
RF1 Control Voltage
E
V2
RF2 Control Voltage
731, 918
734, 98
F
GND T1
Ground 1
186, 885
G
GND T2
Ground 2
186, 420
E
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
930 x 1020(engineering mask)
Die Thickness (µm)
100
Min. Bond Pad
Pitch(µm)
166
Min. Bond pad
opening (µm)
70 x 70
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: [phone] Fax: [phone] Email: [e-mail]
Contact Details (USA): Tel: [phone] Fax: [phone] Email: [e-mail]
Website: www.filcs.com