EFD30 Datasheet, PDF (4/6 Pages) NXP Semiconductors – EFD cores and accessories

Ferroxcube
EFD cores and accessories
EFD30/15/9
COIL FORMERS
General data
PARAMETER
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
SPECIFICATION
phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with
“UL 94V-0”; UL file number E167521 (M)
copper-tin alloy (CuSn), tin (Sn) plated, see note 1
180 °C, “IEC 60085”, class H
“IEC 60068-2-20” , Part 2, Test Tb, method 1B, 350 °C, 3.5 s
“IEC 60068-2-20” , Part 2, Test Ta, method 1: 235 °C, 2 s
12.55 ¹²
max. ^−0.2
3.6
21.55 −0.2
16.4 −0.15
14.98
+0.1
5.23 +0.1 6.6 −0.15
(20.1 min.)
5
15
25
29.2 max.
∅0.8
27.5
31.2 max.
1.3
±0.15
5
CBW502
Dimensions in mm.
Fig.2 EFD30/15/9 coil former; 12-pins.
Winding data and area product for EFD30/15/9 coil former with 12-pins
NUMBER OF
SECTIONS
1
WINDING
AREA
(mm²)
52.3
MINIMUM
WINDING
WIDTH
(mm)
20.1
AVERAGE
LENGTH OF
TURN
(mm)
52.9
AREA
PRODUCT
Ae x Aw
(mm⁴)
3610
Note
1. Also available with post-inserted pins.
TYPE NUMBER
CSH-EFD30-1S-12P⁽¹⁾
2008 Sep 01
4