FODM3010 Datasheet, PDF (9/10 Pages) Fairchild Semiconductor – 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS

4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM-PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3010 FODM3011 FODM3012 FODM3021
FODM3022
FODM3023
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.310 (7.87)
0.190 (4.83)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
180°C
(heating)
to 30 s
230°C (peak temperature)
210°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 9 of 10
11/10/03