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74LCX07MX Datasheet, PDF (8/12 Pages) Fairchild Semiconductor – Low Voltage Hex Buffer with Open Drain Outputs | |||
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Physical Dimensions
8.75
8.50
7.62
14
6.00
A
8
B
4.00
3.80
0.65
5.60
PIN ONE
INDICATOR
1
1.27
(0.33)
7
0.51
0.35
1.70
1.27
LAND PATTERN RECOMMENDATION
0.25 M C B A
1.75 MAX
1.50
1.25
R0.10
R0.10
8°
0°
SEE DETAIL A
0.25
0.10 C
0.10 C
0.25
0.19
NOTES: UNLESS OTHERWISE SPECIFIED
0.50
0.25
A) THIS PACKAGE CONFORMS TO JEDEC
X 45°
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE FLASH OR BURRS.
D) LANDPATTERN STANDARD:
0.36
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 3. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package speciï¬cations do not expand the terms of Fairchildâs worldwide terms and conditions,
speciï¬cally the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductorâs online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LCX07 Rev. 1.11.0
8
www.fairchildsemi.com
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