FODM3053V Datasheet, PDF (7/8 Pages) Fairchild Semiconductor – 4-Pin Full Pitch Mini-Flat Package Random Phase Triac Driver Output Optocouplers

Footprint Drawing for PCB Layout
0.024 (0.61)
0.310 (7.87)
0.190 (4.83)
0.060 (1.52)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
(heating)
to 30 s
180°C
230°C (peak temperature)
210°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
7
FODM3051, FODM3052, FODM3053 Rev. 1.0.0
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