FODM3053 Datasheet, PDF (7/8 Pages) Fairchild Semiconductor – 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS

FODM3051
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3052
FODM3053
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.310 (7.87)
0.190 (4.83)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
180°C
(heating)
to 30 s
230°C (peak temperature)
210°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 7 of 8
11/10/03