FODB100 Datasheet, PDF (7/8 Pages) Fairchild Semiconductor – SINGLE CHANNEL MICROCOUPLER™

SINGLE CHANNEL MICROCOUPLER™
FODB100
FODB101
FODB102
RECOMMENDED INFRARED REFLOW SOLDERING PROFILE
Entrance
Zone 1
Zone 2
Zone 3
Zone 4
Zone 5 Cooling
270.00
236.25
202.50
168.75
135.00
101.25
67.50
33.75
0.00
0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91
Reflow Profile for Pb Free
Average ramp-up rate (183°C to peak)
Preheat Temperature 125(±25)°C to 200°C
Temperature maintained above 220°C
Time within 5°C of actual peak temperature
Peak temperature range
Ramp down rate
Time 25°C to peak temperature
Time (min.)
Convection Reflow
3°C/sec max
60-180°C
60-150 sec
20-40 sec
260 ±5°C
6°C/sec max
8min max
6.57 7.23 7.88
Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome).
© 2004 Fairchild Semiconductor Corporation
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8/19/04