GTLP6C816A Datasheet, PDF (5/7 Pages) Fairchild Semiconductor – LVTTL-to-GTLP Clock Driver

AC Electrical Characteristics
Over recommended range of supply voltage and operating free air temperature. V_REF = 1.0V (unless otherwise noted).
C_L = 30 pF for OBn-Port and C_L = 50 pF for OAn-Port.
Symbol
From (Input)
To (Output)
Min
Typ
(Note 6)
Max
f_TOGGLE
TTLIN
GTLPIN
OBn
175
OAn
175
t_PLH
t_PHL
TTLIN
OBn
1.3
2.3
4.0
0.9
2.6
4.3
t_PLH
t_PHL
t_RISE
t_FALL
t_RISE
t_FALL
OEB
OBn
Transition Time, OB Outputs (20% to 80%)
Transition Time, OB outputs (20% to 80%)
Transition Time, OA outputs (10% to 90%)
Transition Time, OA outputs (10% to 90%)
1.5
2.6
4.1
1.2
2.5
4.1
1.3
1.3
1.2
2.0
t_PZH, t_PZL
OEA
t_PLZ, t_PHZ
t_PLH
GTLPIN
t_PHL
Note 6: All typical values are at V_CC = 3.3 V and T_A = 25°C.
OAn
OAn
0.5
2.9
4.8
0.5
2.4
4.4
1.9
3.6
5.7
2.1
3.5
5.3
Units
MHz
ns
ns
ns
ns
ns
ns
Extended Electrical Characteristics
Over recommended ranges of supply voltage and operating free-air temperature V_REF = 1.0V (unless otherwise noted).
C_L = 30 pF for B Port and C_L = 50 pF for A Port
Symbol
From
To
Typ
Min
Max
Unit
(Input)
(Output)
(Note 7)
t_OSLH (Note 8)
A
B
t_OSHL (Note 8)
A
B
t_PS (Note 9)
A
B
t_PV(HL) (Note 10)(Note 11)
A
B
t_OSLH (Note 8)
B
A
t_OSHL (Note 8)
B
A
t_OST (Note 8)
B
A
t_PS (Note 9)
B
A
t_PV (Note 10)
B
A
Note 7: All typical values are at V_CC = 3.3 V and T_A = 25°C.
0.1
0.2
ns
0.1
0.6
0.3
1.0
ns
1.3
ns
0.1
0.7
ns
0.1
0.4
0.2
1.1
ns
0.1
1.0
ns
2.4
ns
Note 8: t_OSHL/t_OSLH and t_OST – Output-to-Output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs
within the same packaged device. The specifications are given for specific worst case V_CC and temperature and apply to any outputs switching in the same
direction dither HIGH-to-LOW (t_OSHL) or LOW-to-HIGH (t_OSLH) or in opposite directions both HL and LH (t_OST). This parameter is guaranteed by design and
statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the
device.
Note 9: t_PS – Pin or Transition skew is defined as the difference between the LOW-to-HIGH transition and the HIGH-to-LOW transition on the same pin. The
parameter is measured across all the outputs of the same chip is specified for a specific worst case V_CC and temperature. This parameter is guaranteed by
design and statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance
seen by the device.
Note 10: t_PV – Part-to-Part skew is defined as the absolute value of the difference between the actual propagation delay for all outputs from device-to-device.
The parameter is specified for a specific worst case V_CC and temperature. This parameter is guaranteed by design and statistical process distribution. Actual
skew values between the GTLP output could vary on the backplane due to the loading and impedance seen by the device.
Note 11: Due to the open drain structure on GTLP outputs t_OST and t_PV(LH) in the A-to-B direction are not specified. Skew on these paths is dependent on the
V_TT and R_T values on the backplane.
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