FMG2G300LS60E Datasheet, PDF (5/6 Pages) Fairchild Semiconductor – Molding Type Module

Package Dimension
7PM-HA
2- Ø6.5 ±0.30
Mounting-Hole
40.0 ±0.50
23.0 ±0.50 23.0 ±0.50
G2
E2
E1
G1
3-M5
80.0 ±0.50
94.0 ±0.50
3-16.0 ±0.50
3-10.0 ±0.50
2.80 ⁺-^00..0500 *0.5t
Ø1.3
Name Plate
28.0 ±0.50
45.5 ±0.50
©2004 Fairchild Semiconductor Corporation
FMG2G300LS60E Rev. A