QEB373_06 Datasheet, PDF (4/5 Pages) Fairchild Semiconductor – Subminiature Plastic Infrared Emitting Diode

Surface Mount Options for T-3/4 Package
Features
■ Three lead forming options: Gull Wing, Yoke and Z-Bend
■ Compatible with automatic placement equipment
■ Supplied on tape and reel or in bulk packaging
■ Compatible with vapor phase reflow solder processes
Gull Wing Lead Configuration
0.166 (4.2)
0.020 (0.51)
0.074 (1.9)
.118 (3.0) 0.078 (2.0)
.102 (2.6)
0.043 (1.1)
0.106 (2.7)
0.091 (2.3)
0.016 (0.4)
CATHODE
0.087 (2.2)
0.071 (1.8)
0.024 (0.6)
0.055 (1.4)
0.005 (0.13)
Yoke Lead Configuration
0.098 (2.5)
0.283 (7.2)
0.020 (0.5)
0.074 (1.9)
CATHODE
0.087 (2.2)
0.071 (1.8)
0.016 (0.4)
0.118 (3.0)
0.102 (2.6)
0.031 (0.8)
0.051 (1.3)
0.043 (1.1)
0.141 (3.6)
0.055 (1.4)
0.008 (0.2)
Z-Bend Lead Configuration
0.236 (6.0)
0.220 (5.6)
0.127 (3.25)
0.112 (2.85)
0.177 (4.5)
0.161 (4.1)
0.020 (0.5)
0.074 (1.9)
CATHODE
0.087 (2.2)
0.071 (1.8)
0.016 (0.4)
.118 (3.0) 0.080 (2.0)
.102 (2.6)
0.024 (0.6)
0.031 (0.8) ^{0.055 (1.4)}
0.043 (1.1)
0.106 (2.7)
0.091 (2.3)
Notes: (Applies to all package drawings)
1. Dimensions are in inches (mm).
2. Tolerance of ±.010 (.25) on all non nominal dimensions unless otherwise specified.
©2002 Fairchild Semiconductor Corporation
QEB373 Rev. 1.0.0
4
www.fairchildsemi.com