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FAN2013 Datasheet, PDF (3/9 Pages) Fairchild Semiconductor – 2A Low-Voltage Current-Mode Synchronous PWM Buck Regulator
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or any other conditions above those indicated in the oper-
ational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended peri-
ods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless
otherwise specified, all other voltages are referenced to AGND.
Symbol
Parameter
VIN
θJC
TL
TSTG
TJ
Supply Voltage
PVIN and any other pin
Thermal Resistance-Junction to Tab, 3x3mm 6-lead MLP(1)
Lead Soldering Temperature (10 seconds)
Storage Temperature
Junction Temperature
Electrostatic Discharge (ESD) Protection Level(2)
HBM
CDM
Min.
-0.3
-0.3
-65
-40
3.5
2
Max.
6.2
VIN
8
260
150
150
Unit.
V
V
°C/W
°C
°C
°C
kV
Notes:
1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat
sink characteristics.
2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Recommended Operating Conditions
Symbol
Parameter
VIN
VOUT
IOUT
L
CIN
COUT
TA
Supply Voltage Range
Output Voltage Range, Adjustable Version
Output Current
Inductor(3)
Input Capacitor(3)
Output Capacitor(3)
Operating Ambient Temperature Range
Notes:
3. Refer to the Applications Information section for further details.
Min.
4.5
0.8
10
20
-40
Typ.
2.2
20
40
Max.
5.5
VIN
2.0
+85
Unit
V
V
A
μH
μF
μF
°C
© 2006 Fairchild Semiconductor Corporation
FAN2013 Rev. 1.0.0
3
www.fairchildsemi.com