FDMF5821DCCT-ND Datasheet, PDF (24/25 Pages) Fairchild Semiconductor – FDMF5821DC . Smart Power Stage (SPS) Module with Integrated Temperature Monitor

Land Pattern Recommendation
Figure 44. 31-Lead, Clip Bond PQFN SPS, 5.0 mm x 5.0 mm Package Land Pattern Recommendation
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/PQ/PQFN31A.pdf.
© 2013 Fairchild Semiconductor Corporation
FDMF5821DC • Rev. 1.0.1
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