|
FDN306P Datasheet, PDF (2/5 Pages) Fairchild Semiconductor – P-Channel 1.8V Specified PowerTrench MOSFET | |||
|
◁ |
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
DrainâSource Breakdown Voltage
âBVDSS
âTJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
IGSSF
GateâBody Leakage, Forward
IGSSR
GateâBody Leakage, Reverse
VGS = 0 V,
ID = â250 µA
ID = â250 µA,Referenced to 25°C
VDS = â10 V,
VGS = 8 V,
VGS = â8 V,
VGS = 0 V
VDS = 0 V
VDS = 0 V
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
âVGS(th)
âTJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static DrainâSource
OnâResistance
ID(on)
OnâState Drain Current
gFS
Forward Transconductance
VDS = VGS,
ID = â250 µA
ID = â250 µA,Referenced to 25°C
VGS = â4.5 V,
VGS = â2.5 V,
VGS = â1.8V,
ID = â2.6 A
ID = â2.3 A
ID = â1.8 A
VGS = â4.5 V, ID = â2.6A , TJ=125°C
VGS = â4.5 V, VDS = â5 V
VDS = â5 V,
ID = â2.6 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = â6 V,
f = 1.0 MHz
V GS = 0 V,
Switching Characteristics
td(on)
TurnâOn Delay Time
tr
TurnâOn Rise Time
td(off)
TurnâOff Delay Time
tf
TurnâOff Fall Time
Qg
Total Gate Charge
Qgs
GateâSource Charge
Qgd
GateâDrain Charge
(Note 2)
VDD = â6 V,
VGS = â4.5 V,
ID = â1 A,
RGEN = 6 â¦
VDS = â6 V,
VGS = â4.5 V
ID = â2.6 A,
DrainâSource Diode Characteristics and Maximum Ratings
IS
Maximum Continuous DrainâSource Diode Forward Current
VSD
DrainâSource Diode Forward
VGS = 0 V,
IS = â0.42 (Note 2)
Voltage
â12
â0.4
â10
â3
â0.6
2.5
30
39
54
40
10
1138
454
302
11
10
38
35
12
2
3
â0.6
V
mV/°C
â1
µA
100 nA
â100 nA
â1.5
V
mV/°C
40
mâ¦
50
80
54
A
S
pF
pF
pF
20
ns
20
ns
61
ns
56
ns
17
nC
nC
nC
â0.42 A
â1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 250°C/W when mounted on a
0.02 in2 pad of 2 oz. copper.
b) 270°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ⤠300 µs, Duty Cycle ⤠2.0%
FDN306P Rev D W)
|
▷ |