FMS6407_05 Datasheet, PDF (15/17 Pages) Fairchild Semiconductor – Triple Video Drivers with Selectable HD/Progressive/SD/Bypass Filters

FMS6407
DATA SHEET
Package Dimensions
TSSOP-20 and ePAD TSSOP-20
4
B
1.00
32 1
1.00 DIA.
1.00
E1 5
E/2
E
C
B
B
CL
0.20 C A-B D
2X N/2 TIPS
N7
A4
TOP VIEW
D4
H3
b
bbb M C A-B D 9
A₂
0.05 C
A
C
e
5
D
aaa C 8
A1
SEATING
PLANE
13
P
P1 13
SEE DETAIL "A"
END VIEW
WITH PLATING
SIDE VIEW
(b)
b1
BASE METAL
SECTION "B-B"
SCALE: 120/1
(SEE NOTE 10)
e/2
X X = A AND B
EVEN LEAD SIDES
TOPVIEW
X X = A AND B
ODD LEAD SIDES
TOPVIEW
(14°)
c1
(c)
0.25
(OC)
L6
PARTING
LINE
H
(1.00)
(14°)
DETAIL "A"
SCALE: 30/1
(VIEW ROTATED 90° C.W.)
EXPOSED PAD VIEW
SYM
A
A1
A2
aaa
b
b1
bbb
c
c1
D
E1
e
E
L
N
P
P1
OC
Common Dimensions
MIN.
0.05
0.85
0.19
0.19
0.09
0.09
6.40
4.30
0.50
0°
NOM.
0.90
0.076
0.22
0.10
0.127
6.50
4.40
0.65 BSC
6.40 BSC
0.60
20
4.2
3.0
MAX.
1.10
0.15
0.95
0.30
0.25
0.20
0.16
6.60
4.50
0.70
8°
Note: For 0.65mm pitch.
All dimensions in millimeters.
Note
9
5
5
6
7
13
13
NOTES:
1. DIE THICKNESS ALLOWABLE IS 0.279±0.0127 (.0110±.0005 INCHES)
2. DIMENSIONING & TOLERANCES PER ASME. Y14.5M-1994.
3. DATUM PLANE H LOCATED AT MOLD PARTING LINE AND COINCIDENT
WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT BOTTOM OF PARTING LINE.
4. DATUM A-B AND D TO BE DETERMINED WHERE CENTERLINE
BETWEEN LEADS EXITS PLASTIC BODY AT DATUM PLANE H.
5. "D" & "E1" ARE REFERENCE DATUM AND DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS, AND ARE MEASURED AT THE BOTTOM PARTING LINE. MOLD
FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15mm ON D AND 0.25mm
ON E PER SIDE.
6. DIMENSION IS THE LENGTH OF TERMINAL
FOR SOLDERING TO A SUBSTRATE.
7. TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
8. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.076mm AT SEATING PLANE.
9. THE LEAD WIDTH DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE
0.07mm TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION
AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND AN ADJACENT LEAD SHOULD
BE 0.07mm FOR 0.65MM PITCH, 0.08MM FOR 0.50MM PITCH AND
0.07MM FOR 0.40MM PITCH PACKAGES. SEE SECTION "B-B".
10. SECTION "B-B" TO BE DETERMINED AT 0.10
TO 0.25 MM FROM THE LEAD TIP.
11. CONTROLLING DIMENSION: MILLIMETERS.
12. THIS PART IS COMPLIANT WITH JEDEC SPECIFICATION MO-153
VARIATIONS AA/AAT, AB-1/ABT-1, AB/ABT, AC/ACT, AD/ADT, AE/AET
BC-1/BCT-1, BD-1/BDT-1, BE/BET, CA/CAT & CD/CDT
AND MO-194 VARIATIONS AC/ACT & AF/AFT.
13. DIMENSIONS "P" AND "P1" ARE THERMALLY ENHANCED VARIATIONS. VALUES
SHOWN ARE MAXIMUM SIZE OF EXPOSED PAD WITHIN LEAD COUNT AND BODY SIZE.
END USER SHOULD VERIFY AVAILABLE SIZE OF EXPOSED PAD FOR SPECIFIC
DEVICE APPLICATION.
REV. 1I July 2005
15