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74LCX574_08 Datasheet, PDF (13/14 Pages) Fairchild Semiconductor – 74LCX574 | |||
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Physical Dimensions (Continued)
Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package speciï¬cations do not expand the terms of Fairchildâs worldwide terms and conditions,
speciï¬cally the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductorâs online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation
74LCX574 Rev. 1.6.0
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www.fairchildsemi.com
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