FODM30XX Datasheet, PDF (10/11 Pages) Fairchild Semiconductor – 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers

Footprint Drawing for PCB Layout
0.80
1.00
6.50
2.54
Note:
All dimensions are in mm.
Recommended Infrared Reflow Soldering Profile
• Peak reflow temperature: 260°C (package surface temperature)
• Time of temperature higher than 245°C: 40 seconds or less
• Number of reflows: 3
300
10 s
260°C
250
245°C
200
150
40 s
100
50
0
0
50
100
150
200
250
300
Time (s)
10
FODM30XX Rev. 1.0.5
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