FAN3850A Datasheet, PDF (10/11 Pages) Fairchild Semiconductor – Microphone Pre-Amplifier with Digital Output

Physical Dimensions
0.03 C
2X
E
F
A
B
PIN A1
AREA
TOP VIEW
D
0.03 C
2X
A1
0.485
0.570
(Ø0.120)
CU PAD
(Ø0.220)
SOLDER MASK
RECOMMENDED LAND
PATTERN (NSMD)
0.01 C
C
0.06 C
0.300
0.254
E
SEATING
PLANE ^D
SIDE VIEWS
0.197±0.013
0.080±0.010
0.570
0.485
1
0.005 C A B
Ø0.120±0.010
6X
C
B
A
2
(Y) +/-0.018
F
(X) +/-0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 273 MICRONS
±23 MICRONS (254-300 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006AHrev3.
Figure 11. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
FAN3850A External Product Dimensions
Product ID
D
E
X
All options
1.260mm
Ball Composition: SN97.5-Ag2.5
0.860mm
0.145mm
Y
0.145mm
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warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
specifications. http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FAN3850A • Rev. 3.0.6
10
www.fairchildsemi.com