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IRFM110A Datasheet, PDF (1/7 Pages) Fairchild Semiconductor – Advanced Power MOSFET
Advanced Power MOSFET
FEATURES
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 µA (Max.) @ VDS = 100V
Lower RDS(ON) : 0.289 Ω (Typ.)
Absolute Maximum Ratings
Symbol
VDSS
ID
IDM
VGS
EAS
IAR
EAR
dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TA=25ΟC )
Continuous Drain Current (TA=70ΟC )
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
O2
Avalanche Current
O1
Repetitive Avalanche Energy
O1
Peak Diode Recovery dv/dt
O3
Total Power Dissipation (TA=25ΟC ) *
Linear Derating Factor *
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from case for 5-seconds
IRFM110A
BVDSS = 100 V
RDS(on) = 0.4 Ω
ID = 1.5 A
SOT-223
2
1
3
1. Gate 2. Drain 3. Source
Value
100
1.5
1.19
12
+_ 20
60
1.5
0.2
6.5
2
0.016
- 55 to +150
300
Units
V
A
A
V
mJ
A
mJ
V/ns
W
W/ ΟC
ΟC
Thermal Resistance
Symbol
R θJA
Characteristic
Junction-to-Ambient *
Typ.
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max.
62
Units
ΟC/ W
Rev. B
©1999 Fairchild Semiconductor Corporation