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GTLP16612 Datasheet, PDF (1/9 Pages) Fairchild Semiconductor – CMOS 18-Bit TTL/GTLP Universal Bus Transceiver
March 1995
Revised October 1998
GTLP16612
CMOS 18-Bit TTL/GTLP Universal Bus Transceiver
General Description
The GTLP16612 is an 18-bit universal bus transceiver
which provides TTL to GTLP signal level translation. The
device is designed to provide a high speed interface
between cards operating at TTL logic levels and a back-
plane operating at GTLP logic levels. High speed back-
plane operation is a direct result of GTLP’s reduced output
swing (<1V), reduced input threshold levels and output
edge rate control which minimizes signal settling times.
GTLP is a Fairchild Semiconductor derivative of the Gun-
ning Transceiver Logic (GTL) JEDEC standard JESD8-3.
Fairchild’s GTLP has internal edge-rate control and is Pro-
cess, Voltage, and Temperature (PVT) compensated. Its
function is similar to BTL or GTL but with different driver
output levels and receiver threshold. GTLP output low volt-
age is typically less than 0.5V, the output high is 1.5V and
the receiver threshold is 1.0V.
Features
s Bidirectional interface between GTLP and TTL logic
levels
s Designed with Edge Rate Control Circuit to reduce
output noise
s VREF pin provides external supply reference voltage for
receiver threshold
s Submicron Core CMOS technology for low power
dissipation
s Special PVT Compensation circuitry to provide consis-
tent performance over variations of process, supply
voltage and temperature
s 5V tolerant inputs and outputs on A-Port
s Bus-Hold data inputs on A-Port to eliminate the need for
external pull-up resistors for unused inputs
s Power up/down high impedance
s TTL compatible Driver and Control inputs
s A-Port outputs source/sink −32 mA/+32 mA
s Flow-through architecture optimizes PCB layout
s Open drain on GTLP to support wired-or connection
Ordering Code:
Order Number Package Number
Package Description
GTLP16612MEA
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118 0.300” Wide
GTLP16612MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 1998 Fairchild Semiconductor Corporation DS012390.prf
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