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FDMS8660S_08 Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – N-Channel PowerTrench SyncFETTM
June 2008
FDMS8660S
N-Channel PowerTrench® SyncFETTM
tm
30V, 40A, 2.4mΩ
Features
General Description
„ Max rDS(on) = 2.4mΩ at VGS = 10V, ID = 25A
„ Max rDS(on) = 3.5mΩ at VGS = 4.5V, ID = 21A
„ Advanced Package and Silicon combination for low rDS(on)
and high efficiency
„ SyncFET Schottky Body Diode
„ MSL1 robust package design
„ RoHS Compliant
The FDMS8660S has been designed to minimize losses in
power conversion applications. Advancements in both silicon
and package technologies have been combined to offer the
lowest rDS(on) while maintaining excellent switching
performance. This device has the added benefit of an efficient
monolithic Schottky body diode.
Application
Synchronous Rectifier for DC/DC Converters
„ Notebook Vcore/ GPU low side switch
„ Networking Point of Load low side switch
„ Telecom secondary side rectification
Pin 1
S
S
S
G
D
D
DD
Power 56 (Bottom view)
D5
D6
D7
D8
4G
3S
2S
1S
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
ID
EAS
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
-Continuous (Silicon limited)
-Continuous
-Pulsed
TC = 25°C
TC = 25°C
TA = 25°C
Single Pulse Avalanche Energy
Power Dissipation
TC = 25°C
Power Dissipation
TA = 25°C
Operating and Storage Junction Temperature Range
(Note 1a)
(Note 3)
(Note 1a)
Thermal Characteristics
RθJC
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
Device Marking
FDMS8660S
Device
FDMS8660S
Package
Power 56
Reel Size
13’’
©2008 Fairchild Semiconductor Corporation
1
FDMS8660S Rev C3
Ratings
30
±20
40
147
25
200
937
83
2.5
-55 to +150
Units
V
V
A
mJ
W
°C
1.5
°C/W
50
Tape Width
12mm
Quantity
3000 units
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