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FDMF6704_09 Datasheet, PDF (1/14 Pages) Fairchild Semiconductor – The Xtra Small, High Performance, High Frequency DrMOS Module
August 2009
FDMF6704 - XSTM DrMOS
tm
The Xtra Small, High Performance, High Frequency DrMOS Module
Benefits
Ultra compact size - 6 mm x 6 mm MLP, 44 % space
saving compared to conventional MLP 8 mm x 8 mm
DrMOS packages.
Fully optimized system efficiency.
Clean voltage waveforms with reduced ringing.
High frequency operation.
Compatible with a wide variety of PWM controllers in the
market.
Features
Ultra- compact thermally enhanced 6 mm x 6 mm MLP
package 84 % smaller than conventional discrete solutions.
Synchronous driver plus FET multichip module.
High current handling of 35 A.
Over 93 % peak efficiency.
Tri-State PWM input.
Fairchild's PowerTrench® 5 technology MOSFETs for clean
voltage waveforms and reduced ringing.
Optimized for high switching frequencies of up to 1 MHz.
Skip mode SMOD [low side gate turn off] input.
Fairchild SyncFETTM [integrated Schottky diode] technology
in the low side MOSFET.
Integrated bootstrap Schottky diode.
Adaptive gate drive timing for shoot-through protection.
Driver output disable function [DISB# pin].
Undervoltage lockout (UVLO).
Fairchild Green Packaging and RoHS
compliant. Low profile SMD package.
Power Train Application Circuit
5V
CVDRV
DISB#
PWM Input
OFF
ON
VDRV VCIN VIN
DISB#
BOOT
PWM
SMOD#
PHASE
VSWH
CGND PGND
General Description
The XSTM DrMOS family is Fairchild’s next-generation fully-
optimized, ultra-compact, integrated MOSFET plus driver power
stage solutions for high current, high frequency synchronous
buck DC-DC applications. The FDMF6704 XSTM DrMOS
integrates a driver IC, two power MOSFETs and a bootstrap
Schottky diode into a thermally enhanced, ultra compact 6 mm x
6 mm MLP package. With an integrated approach, the complete
switching power stage is optimized with regards to driver and
MOSFET dynamic performance, system inductance and
RDS(ON). This greatly reduces the package parasitics and layout
challenges associated with conventional discrete solutions.
XSTM DrMOS uses Fairchild's high performance
PowerTrenchTM 5 MOSFET technology, which dramatically
reduces ringing in synchronous buck converter applications.
PowerTrenchTM 5 can eliminate the need for a snubber circuit in
buck converter applications. The driver IC incorporates
advanced features such as SMOD for improved light load
efficiency and a Tri-State PWM input for compatibility with a
wide range of PWM controllers. A 5 V gate drive and an
improved PCB interface optimized for a maximum low side FET
exposed pad area, ensure higher performance. This product is
compatible with the new Intel 6 mm x 6 mm DrMOS
specification.
Applications
Compact blade servers V-core, non V-core and VTT DC-DC
converters.
Desktop computers V-core, non V-core and VTT DC-DC
converters.
Workstations V-core, non V-core and VTT DC-DC
converters.
Gaming Motherboards V-core, non V-core and VTT DC-DC
converters.
Gaming consoles.
High-current DC-DC Point of Load (POL) converters.
Networking and telecom microprocessor voltage regulators.
12 V
CVIN
RBOOT
CBOOT
LOUT
OUTPUT
COUT
Ordering Information
Order Number
FDMF6704
Marking
FDMF6704_1
Figure 1. Power Train Application Circuit
Temperature Range
Device Package
-55 °C to 150 °C 40 Pin, 3 DAP, MLP 6x6 mm
Packing Method
Tape and Reel
Quantity
3000
©2008 Fairchild Semiconductor Corporation
1
FDMF6704 Rev. G
www.fairchildsemi.com