EMP201 Datasheet, PDF (3/3 Pages) Excelics Semiconductor, Inc. – 17.5 - 21.0 GHz Power Ammplifier MMIC

ASSEMBLY DRAWING
EMP201
17.5 – 21.0 GHz Power Ammplifier MMIC
Issued Date: 12-18-03
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50
ohm line and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 1000 x 2250 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: [phone] Fax: [phone] Web: www.excelics.com