EMP311 Datasheet, PDF (2/2 Pages) Excelics Semiconductor, Inc. – 21.0 - 24.0 GHz Power Amplifier MMIC

PRELIMINARY DATA SHEET
ASSEMBLY DRAWING
EMP311
21.0 – 24.0 GHz Power Amplifier MMIC
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line
and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip size 1130 X 2250 microns
Chip Thickness: 75±13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 2 of 2
Phone: [phone] Fax: [phone] Web: www.excelics.com
Revised September 2004