XRP2997 Datasheet, PDF(6/8 Page) Exar Corporation – 2A DDR I/II/III Bus Termination Regulator

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XRP2997 Datasheet, PDF (6/8 Pages) Exar Corporation – 2A DDR I/II/III Bus Termination Regulator

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XRP2997

2A DDR I/II/III Bus Termination Regulator

Fig. 11: VIN=2.5V, VREF=1.25V source short circuit

Fig. 12: VIN=1.5V, VREF=0.75V sink short circuit

Fig. 13: VIN=1.8V, VREF=0.9V sink short circuit

Fig. 14: VIN=2.5V, VREF=1.25V sink short circuit

APPLICATION INFORMATION

LAYOUT CONSIDERATIONS

The XRP2997 is offered in the 8-pin exposed-

pad SOIC package in order to facilitate power

dissipation (heat dissipation). Power

dissipation can be maximized by soldering the

exposed pad to a large land area on top layer

of PCB and by using vias to connect the

exposed pad to an interlayer(s) or bottom

layer. All capacitors should be placed as close

as possible to the respective pins.

6/8

Rev. 1.0.0

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