SP510E Datasheet, PDF (41/43 Pages) Exar Corporation – ULTRA HIGH SPEED MULTIPROTOCOL TRANSCEIVER

SP510E
REV. 1.0.1
ULTRA HIGH SPEED MULTIPROTOCOL TRANSCEIVER
Thermal Considerations
High speed devices like the SP510E dissipate heat during normal operation. Actual power dissipation is a
function of the switching frequency and loading. For maximum system performance and reliability designers
should ensure sufficient air flow. Other commonly used methods for managing heat include heat sinks for
higher powered devices, forced air flow (fans) and lower density board stuffing.
PCB Design
The use of multi layer printed circuit boards is recommended to provide both a better ground plane and a
thermal path for heat dissipation. If possible, the ground plane should face the bottom of the package to form
the thermal conduction plane. Two-sided printed circuit boards may be used where board dimensions and
package count are small, but multi-layer boards allow for improved signal routing as well as improved signal
integrity. A multi-layer board allows microstrip line techniques for high speed signal interconnections when the
high speed signal lines on the inner layers.
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