XR16M2550IL32-F Datasheet, PDF (36/47 Pages) Exar Corporation – HIGH PERFORMANCE LOW VOLTAGE DUART WITH 16-BYTE FIFO

XR16M2550
HIGH PERFORMANCE LOW VOLTAGE DUART WITH 16-BYTE FIFO
REV. 1.0.2
5.0 ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Power Supply Range
Voltage at Any Pin
Operating Temperature
Storage Temperature
Package Dissipation
4 Volts
GND-0.3V to 4V
-40^o to +85^oC
-65^o to +150^oC
500 mW
TYPICAL PACKAGE THERMAL RESISTANCE DATA (MARGIN OF ERROR: ± 15%)
Thermal Resistance (48-TQFP)
theta-ja =59^oC/W, theta-jc = 16^oC/W
Thermal Resistance (32-QFN)
theta-ja = 33^oC/W, theta-jc = 22^oC/W
DC ELECTRICAL CHARACTERISTICS
TA=-40^o to +85^oC, Vcc is 1.62V to 3.63V
SYMBOL
PARAMETER
V_ILCK Clock Input Low Level
V_IHCK Clock Input High Level
V_IL Input Low Voltage
V_IH Input High Voltage
V_OL Output Low Voltage
LIMITS
1.8V
MIN
MAX
-0.3
0.3
1.4 VCC
-0.3 0.2
1.4 VCC
0.4
V_OH Output High Voltage
1.4
I_IL Input Low Leakage Current
±10
I_IH Input High Leakage Current
±10
C_IN Input Pin Capacitance
5
I_CC Power Supply Current
0.5
I_SLEEP Sleep Current
5
LIMITS
2.5V
MIN
MAX
-0.3 0.6
1.8 VCC
-0.3 0.5
1.8 VCC
0.4
1.8
±10
±10
5
1
8
LIMITS
3.3V
MIN
MAX
-0.3 0.6
UNITS
V
CONDITIONS
2.4 VCC V
-0.3 0.8
V
2.0 VCC V
0.4
V I_OL = 4 mA
V _{IOL = 2 mA}
V _{IOL = 1.5 mA}
2.0
V I_OH = -1 mA
V _{IOH = -400 uA}
V _{IOH = -200 uA}
±10 uA
±10 uA
5
pF
2
mA XTAL1 = 2 MHz
15
uA See Test 1
Test 1: The following inputs must remain steady at VCC or GND state to minimize Sleep current: A0-A2, D0-
D7, IOR#, IOW#, CSA#, CSB# and all modem inputs. Also, RXA and RXB inputs must idle HIGH while asleep.
Floating inputs will result in sleep currents in the mA range. For PowerSave feature that isolates address, data
and control signals, please see the XR16M2551 data sheet.
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