XR76115 Datasheet, PDF (13/16 Pages) Exar Corporation – 15A Synchronous Step Down COT Regulator

XR76115
Thermal Design
Proper thermal design is critical in controlling device
temperatures and in achieving robust designs. There are a
number of factors that affect the thermal performance.
One key factor is the temperature rise of the devices in the
package, which is a function of the thermal resistances of
the devices inside the package and the power being
dissipated.
The thermal resistance of the XR76115 is specified in the
“Operating Ratings” section of this datasheet. The JEDEC
θJA thermal resistance provided is based on tests that
comply with the JESD51-2A “Integrated Circuit Thermal
Test Method Environmental Conditions – Natural
Convection” standard. JESD51-xx are a group of
standards whose intent is to provide comparative data
based on a standard test condition which includes a
defined board construction. Since the actual board design
in the final application will be different from the board
defined in the standard, the thermal resistances in the final
design may be different from those shown.
The package thermal derating curves for the XR76115 are
shown in Figures 25 and 26. These correspond to input
voltage of 12V and 5V respectively.
© 2015 Exar Corporation
13/16
www.exar.com
Rev. 1B