P02221B2P Datasheet, PDF (6/6 Pages) Eudyna Devices Inc – 500mW InGaP HBT Amplifier

P02221B2P
500mW InGaP HBT Amplifier
Technical Note
♦Caution
InGaP/GaAs HBT chips are used in P02221B2P. For safety
reasons, you should attend to the following matters:
(1) Do not put the products in your mouse.
(2) Do not make the products into gases or powders, by
burning, breaking or chemical treatments.
(3) In case you abandon the products, you should obey the
related laws and regulations.
The information in this document is subject to change without notice. Please refer for the most
up-to-date information before you start design using Eudyna’s devices.
Any part of this document may not be reproduced or copied.
Eudyna does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of Eudyna’s products described in this
documents. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of Eudyna or others.
Descriptions of circuits and other related information in this document are for illustrative purpose in the
examples of the device operation and application. Eudyna does not assume any responsibility for any
losses incurred by customers or third parties arising from the use of the circuits and other related
information in this document.
Eudyna’s semi-conductor device products are designed and manufactured for use in the standard
communication equipment. Customers that wish to use these products in applications not intended by
Eudyna must contact Eudyna’ sales representatives in advance.
Generally, it is impossible to eliminate completely the defects in semi-conductor products, while
Eudyna has been continually improving the quality and reliability of the products. Eudyna does not
assume any responsibility for any losses incurred by customers or third parties by or arising from the
use of Eudyna’s semi-conductor products. Customers are to incorporate sufficient safety measures in the
design such as redundancy, fire-containment and anti-failure features.
Specifications and information are subject to change without notice.
2005-07
Eudyna Devices Inc. 1,Kanai-cho, Sakae-ku, Yokohama, 244-0845 Japan
Phone : [phone] Fax : [phone] e-mail : [e-mail] Web Site : www.eudyna.com
-6-