FMM5803X Datasheet, PDF (4/4 Pages) Eudyna Devices Inc – 27.5-31.5GHz Power Amplifier MMIC

FMM5803X
27.5-31.5GHz Power Amplifier MMIC
270
2080
1925
VGG
CHIP OUTLINE
VDD1
970
1230
VDD2
1500
2010
VDD3
2950
Unit: µm
990
RFin
1030
RFout
155
0
120
1230
1500
VDD4
For further information please contact:
FUJITSU COMPOUND SEMICONDUCTOR, INC.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
Phone: [phone]
FAX: [phone]
www.fcsi.fujitsu.com
FUJITSU MICROELECTRONICS, LTD.
Compound Semiconductor Division
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
Phone:[phone]
FAX:[phone]
2010
3340
2950
VDD5
3225
Chip Size: 3340±30µm x 2080±30µm
Chip Thickness: 70±20µm
Pad Dimensions: 1. DC 80µm x 80µm
2. RF 120µm x 80µm
CAUTION
Fujitsu Compound Semiconductor Products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
Fujitsu Limited reserves the right to change products and specifications without notice.
The information does not convey any license under rights of Fujitsu Limited or others.
© 2000 FUJITSU COMPOUND SEMICONDUCTOR, INC.
Printed in U.S.A. FCSI0200M200
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