FMM5822X Datasheet, PDF (13/14 Pages) Eudyna Devices Inc – K-Band Power Amplifier MMIC

FMM5822X
K-Band Power Amplifier MMIC
DIE ATTACH
1) The die-attach station must have accurate temperature control and an inert forming gas should
be used.
2) Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Preform Volume : per next Figure
2500
2000
1500
FMM5822X
1000
500
0
0
2
4
6
8
10 12 14
16 18 20
Area of Chip Bach Surface (mm^2)
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N ± 0.0196 N
Stage Temperature : 215 deg.C ± 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
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