FMM5822X Datasheet, PDF (11/14 Pages) Eudyna Devices Inc – K-Band Power Amplifier MMIC

FMM5822X
K-Band Power Amplifier MMIC
Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
VGG1
0 120
620
2760
2640
2555
VDD2
1155
VDD4
3075 3450 3570
2760
2510
RF-IN 1194
1380 RF-OUT
280
205
120
0
0 120 636 750 1155
VDD1 (VGG2) VDD3
250
0
3075 3450 3570
VDD5
Chip Size : 3570 30um x 2760
Chip Thickness : 70 20um
Bonding Pad Size :
RF-Pad : 120um x 80um
VGG-Pad : 80um x 80um
VDD-Pad : 100um x 100um
30um
: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2).
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