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| FMM5063X Datasheet, PDF (11/14 Pages) Eudyna Devices Inc – Ku-Band Power Amplifier MMIC | |||
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FMM5063X
Ku-Band Power Amplifier MMIC
â Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
2770
2550
VGG1
0 120 335
VDD1 VDD3
905 1350
VDD5
2845 3315 3435
2770
2575
RF-IN 1385
1385 RF-OUT
150
0
0 120 335
905 1350
(VGG2) VDD2 VDD4
125
0
2845 3315 3435
VDD6
Chip Size : 3435±30um x 2770±30um
Chip Thickness : 60±20um
Bonding Pad Size : 160um x 80um
ï¼®ï½ï½ï½
: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2).
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