TS32101 Datasheet, PDF (9/12 Pages) List of Unclassifed Manufacturers – High Efficiency DC/DC Boost Converter for USB, 2Mhz

RECOMMEDED PCB LAND PATTERN
TS32101
Version 2.0
Silk Screen
RECOMMENDED
LAND PATTERN
DIMENSIONS IN MILLIMETERS
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
W2
Optional Center Pad Length
T2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
Distance Between Pads
G
MILLIMETERS
MIN NOM MAX
0.50 BSC
-
-
1.70
-
-
1.70
-
3.00
-
-
3.00
-
-
-
0.35
-
-
0.65
0.15
-
-
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only.
PACAKGING INFORMATION
Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC-
1752 Level 3 materials declaration requirements.
MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak
Profile Solder Temperature (Tp) of 260°C.
Specifications subject to change
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