TS32101 Datasheet, PDF (10/12 Pages) List of Unclassifed Manufacturers – High Efficiency DC/DC Boost Converter for USB, 2Mhz

TS32101
Version 2.0
APPLICATION USING A MULTI-LAYER PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be
followed when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
JEDEC standard FR4 PCB Cross-section:
Package and PCB Land Configuration
For a Multi-Layer PCB
(square) ^{Package Solder Pad}
2 Plane
4 Plane
1.5748mm
Thermal Via
Thermal Isolation
Power plane only
Package Solder Pad
(bottom trace)
Component Traces
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
1.0142 - 1.0502 mm
Ground Plane
(1oz Cu)
0.5246 - 0.5606 mm
Power Plane
(1oz Cu)
0.0 - 0.071 mm Board Base
& Bottom Pad
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.
Specifications subject to change
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