300P14-U Datasheet, PDF (4/5 Pages) List of Unclassifed Manufacturers – 4 Matched NPN Transistors

Document 600041 Rev 02
Page 4 of 5
THAT 300 Series Transistor Array ICs
Packaging and Soldering Information
The THAT 300, 320 and 340 are available in 14-pin
PDIP and 14-pin surface mount (SOIC) packages.
Package dimensions are shown below.
The 300-series packages are entirely lead-free. The
lead-frames are copper, plated with successive layers of
nickel, palladium, and gold. This approach makes it
possible to solder these devices using lead-free and lead-
bearing solders.
Neither the lead-frames nor the plastic mold
compounds used in the 300-series contains any hazard-
ous substances as specified in the European Union's
Directive on the Restriction of the Use of Certain Hazard-
ous Substances in Electrical and Electronic Equipment
2002/95/EG of January 27, 2003. The surface-mount
package is suitable for use in a 100% tin solder process.
Package Characteristics
Parameter
Symbol
Conditions
Typ
Through-hole package
See Fig. 4 for dimensions
14 Pin PDIP
Thermal Resistance
θJA DIP package soldered to board
100
Environmental Regulation Compliance
Complies with January 27, 2003 RoHS requirements
Surface mount package
See Fig. 5 for dimensions
14 Pin SOP
Thermal Resistance
θJA SO package soldered to board
100
Soldering Reflow Profile
JEDEC JESD22-A113-D (250 ºC)
Moisture Sensitivity Level
MSL Above-referenced JEDEC soldering profile
1
Environmental Regulation Compliance
Complies with RoHS requirements
Units
ºC/W
ºC/W
0.750±0.004
(19.05±0.10)
1
0.060
(1.52)
Typ.
0.25±.004
(6.35±0.10)
0.30 ±0.02
(7.62 ±0.5)
0.125±0.004
(3.18±0.10)
0.10 Typ.
(2.54)
0.075
(1.91)
0.018
(0.46)
0.010
(0.25)
Figure 4. Dual-In-Line Package Outline
0.050
(1.27)
Typ
0.157 0.245
(3.99) (6.2)
Max Max
1
0.018 (0.46)
Max
0.344 (8.74)
Max
0.069
(1.75)
Max
0.010
(0.25)
Max
Figure 5. Surface-Mount Package Outline
THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com
Copyright © 2010, THAT Corporation. All rights reserved.