FGSR12SR6003A Datasheet, PDF (22/23 Pages) List of Unclassifed Manufacturers – 3-14.4Vdc Input, 3A, 0.6-5.5Vdc Output

Delivering Next Generation Technology
FGSR12SR6003*A
3-14.4Vdc Input, 3A, 0.6-5.5Vdc Output
Series
Data Sheet
Surface Mount Information
Pick and Place
The 3A Analog Tomodachi modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well
as safety standards, and is able to withstand reflow
temperatures of up to 300°C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 7mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on
the bottom side of a customer board. If such an
assembly is attempted, components may fall off the
module during the second reflow process.
Lead Free Soldering
The modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering
process. Failure to observe the instructions below
may result in the failure of or cause damage to the
modules and can adversely affect long-term
reliability.
instructions. The recommended linear reflow profile
using Sn/Ag/Cu solder is shown in Fig-49. Soldering
outside of the recommended profile requires testing
to verify results and performance.
MSL Rating
The 3A Analog Tomodachi modules have a MSL
rating of 2a.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of  30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following
conditions: < 40°C, < 90% relative humidity.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
200
150
Heating Zone
1°C/ Se cond
100
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
50
0
Reflow Time (Seconds)
Fig-49: Recommended linear reflow profile
using Sn/Ag/Cu solder.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture / Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). For questions regarding Land grid array
(LGA) soldering, solder volume; please contact
Lineage Power for special manufacturing process
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.
The result of inadequate cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Http://www.fdk.com
Page 22 of 23
Ver 2.0 Nov. 11, 2013