WA04X330JTL Datasheet, PDF (2/9 Pages) List of Unclassifed Manufacturers – General purpose chip resistors array

Approval sheet
FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
5. RoHS compliant and lead free products.
APPLICATION
• Consumer electrical equipment
• EDP, Computer application
• Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is Tin (lead free) alloy.
Fig 1. Consctruction of a Chip-R array (convex Type) Fig 2. Consctruction of a Chip-R array (concave Type)
Page 2 of 9
ASC_WA04/06_V15
Oct.2010