IC189-0162-019 Datasheet, PDF (2/7 Pages) List of Unclassifed Manufacturers – SOP (Small Outline Packages, Gullwing Leads)

Series Overview
*SOP (Small Outline Packages, Gullwing Leads)
SMT Devices
Series IC191 (Open Top)
Thin Small Outline Package (TSOP Type I)
Specifications
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Current Rating:
1A max.
Operating Temperature Range: –40°C to +170°C
–40°C to +150°C (type -004*)
Mating Cycles:
10,000 insertions min.
Contact Force:
20g to 80g per pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
0.5mm Pitch
Part Number (Details)
IC191 - 032 2 - 001 *
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Contact Styles
Series IC51
Series IC (two point
Contact)
Series IC235
Series IC (kelvin)
Series IC189 / IC191
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
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41 Test Solutions